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Speaker-Johan Liu

Johan Liu
Chalmers University of Technology, Sweden
Professor Johan Liu graduated with a master and Ph D degree in Materials Science and Engineering from the Royal Institute of Technology, Stockholm, Sweden in 1984 and 1989 respectively. He served in various positions at the Swedish Institute for Production Research (IVF), Gothenburg as project manager, group leader and division manager between 1989 and 1999. He is since then a full professor in electronics production, Chalmers University of Technology, Sweden.As a member of the Royal Swedish Academy of Engineering Sciences, a Fellow of IEEEand a member of the European Nanoelectronics Association (Aeneas), he has published 2 books, 480 papers in journals, conference proceedings and 15 book chapters with a Hirsch index of 34 and with a citation of over 3400 times. He has over 50 patents accepted or filed and has given 50 key note/invited talks during the last 20 years. In addition, he has also received many awards including IEEE CPMT Exceptional Technical Achievement Award, IEEE CPMT Transaction Best paper Award in “Advanced Packaging”. He is also one of the founding members of three companies in Sweden: SHT Smart High Tech AB, SHT Sinterma AB and 3Dtro AB and serves on the Scientific Advisory Board for Henkel, Pacific Region.
Title:Vertically Aligned Graphene based materials for heat dissipation applications
SymposiumHeat Management & China - Sweden Graphene Bilateral Cooperation Forum
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Abstract

In many heat dissipation applications, directional control is essential. Here we report recent progress of using graphene based materials to achieve this purpose. Graphene as one of the 2D materials has extremely high difference in heat dissipation capacity with over 1000 times better in lateral plan than out of plan. We have fabricated a number of vertically aligned graphene based structures using CVD and chemical reduction method to producing graphene based vertical structure and graphene based film. The results show that we can produce vertically aligned graphene based film as thermal interface material with a thermal conductivity value over 50 W/mK. This is an extremely high value in vertical heat dissipation which can find potential interesting applications in heat dissipation, especially for electronics and high power devices.

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Abstract: Minyang Lu

Sponsor: Wenyang Yang

Media: Liping Wang

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