凯发

Based on the fast growth of the device performance, there has been an increasing demand for handling the issue of thermal management in electronic equipments. In order to exclude air from the gap between the mating surfaces of the chip and the heat sink, thermal interface materials are commonly used for guaranteeing efficient heat transfer across the gap. Thermal interface materials were usually made by mixing the thermally conductive fillers (graphene, CNTs etc.) into the silicone matrix. However, the difficulty of graphene dispersion, the strong interfacial phonon scattering, and the poor compressibility at high graphene content restrict the performance of graphene-based thermal interface materials. The creation of well-defined graphene arrangement in the silicone matrix may lead to a remarkable improvement of through-plane thermal conductivity of the materials, meanwhile maintaining good mechanical property. Our thermal interface materials demonstrate the superior ability to solve the heat dissipation issues in high-power, high-frequency electronic systems.