Dr Lilei Ye graduated with a Ph D degree in Experimental Physics in Chalmers University of Technology with a focus on microscopy analysis of lead frees older and conductive adhesive materials used in electronic packaging. Before joining SHT Smart High Tech AB, she worked with material technology and failure analysis on metallic and interconnect materials in Volvo AB. Since 2010 she became research manager of SHT and was in charge of the developments with respect to novel thermal interface materials, CNT-based interconnect materials and graphene used in electronic packaging. From 2013 she became CEO of SHT responsible for overall planning and management.
Light-weight,Compressible and Highly Thermal Conductive Graphene-based Thermal Interface Material
LileiYe1, Nan Wang1 and Johan Liu2
1. SHT Smart High Tech AB, HugoGrauers Gata 3B, 41133 Gothenburg, Sweden
2. Electronics Materials and Systems Laboratory, Department of Microtechnology and Nanoscience (MC2)Chalmers University of Technology, Kemivägen 9, Se 412 96 Göteborg, Sweden
High density packaging in combination with increased transistor integration inevitably leads to challenging power densities in terms of thermal management. Thermal interface materials (TIMs) play a key role in thermal management by transferring heat from the surface of power devices. The conventional TIMs used in the microelectronics industry today basically are particle laden polymer matrix composites,which have the advantages of good reliability and ease of use.However, the thermal conductivity (K)of these composites is generally limited to 10 W/mK, which is hard to meet the goal for efficient thermal management in power devices. Here, we solve the problem by applying a novel highly thermal conductive and compressible graphene based TIMs (GTs). Composed by vertical graphene structures, GTs provide a continuous high thermal conductivity phase along the path of thermal transport, which lead to outstanding thermal properties. By tailoring ratios of graphene in the polymer binder, bulk thermal conductivity of GTs can be varied from 50 to 1000 W/mK. This result is much higher than conventional TIMs,and even outperforms the metal-based TIMs. Meanwhile, the highly flexible and foldable nature of vertical graphene enables at least 20% compressibility of the GTs upon applied pressure (≤ 400 KPa). As excellent gap fillers, GT can provide complete physical contact between two surfaces and thereby minimize the contact resistance to heat flow. The GTs opens new opportunities for addressing large heat dissipation issues both in through-plane and in-plane directions for form-factor driven electronics and other high power driven systems.
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E-mail: meeting@c-gia.org
Abstract: Minyang Lu
Sponsor: Wenyang Yang
Media: Liping Wang
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