凯发_Cheng

Speaker-Cheng-Te Lin

Cheng-Te Lin
Ningbo Institute of Material Technology & Engineering, CAS

Dr. Cheng-Te Lin received his Ph.D. degree in Materials Science and Engineering at National Tsing Hua University (Taiwan) in 2008. In 2012, he was a postdoc in Prof. Jing Kong's group at Massachusetts Institute of Technology (MIT, USA), and undertook the investigation of graphene aerogel supercapacitors. Subsequently, he took part in the project of highly thermally-conductive polymer composites with Prof. Gang Chen (MIT, USA). From 2014 June, he is working as a full professor at Ningbo Institute of Material Technology and Engineering. He is the recipient of "1000 Young Talents Plan" from China's government (2015), "Hundred Talents Program"from Chinese Academy of Sciences (2014), and so on. Dr. Lin has 56 publications on Nature Communications, Advanced Functional Materials, Journal of Materials Chemistry A, and Carbon etc. His research interests focus on the development of graphene-based applications, including CVD growth technique, functional composites, thermal interface materials, and biosensors.

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SymposiumChemicals

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Abstract

　　近年来，随着高功率与高速电子元器件的迅猛发展，对于电子元器件与装备进行有效热管理，以避免器件因过热导致热失效有了迫切的需求。工程塑料普遍用于器件与设备的外壳、封装等关键零组件，然而，塑料本身的热导率非常低。通过与石墨烯等纳米碳材料进行复合，能有效提升高分子基底的热导率，然而，一般石墨烯很难在高分子基底中进行有效分散，另外，石墨烯/高分子微观界面的热阻很高，这两个因素限制了复合材料热导率的进一步提升。为了克服以上的瓶颈问题，本课题在高分子基底中引入了石墨烯的立体仿生结构，能够在低石墨烯含量下实现复合材料热导率的大幅提高，可望在热管理与电子封装等领域形成广泛应用。

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Abstract: Minyang Lu

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