Professor Bill Brox is currently a professor at Chalmers University of Technology, Sweden and a member of The Royal Swedish Academy of Engineering Science (IVA).
He obtained master degree in chemistry from Uppsala University, Sweden in 1978 and PhD degree from the Department of Engineering Metals, Chalmers University of Technology, Sweden in 1987. He served in various positions at the Swedish National Production Research Institute (IVF) as group leader, division and vice president between 1988 and 1998 looking after the electronics production business. He became CEO of the Swedish Microelectronics Research Institute in Gothenburg (IMEGO) in 1998 and served under that capacity under 2013. Since 2011, he is a professor at Chalmers University of Technology,Gothenburg Sweden.
Professor BillBrox has published close 100 papers. He received many awards including the EPA Stratospheric Ozone Protection Award from United Nations (UN) for his leadership work in coordinating the Inter-Nordic CFC phase-out-programme, which resulted in a Nordic phase-out of CFCs in January 1991. Bill Brox also contributed to the CFC-phase out program in China in 1996.
His research work is mainly in corrosion related mechanisms in electronics packaging, production and systems. He has developed in very early stage testing methods and standard for corrosion induced failure analysis. For this, he led a huge research activity at IVF towards environmentally related cleaning technology with great success and impact on the world-wide electronics industry.
Graphene and Carbon Nanotube have been received much attention in the microelectronics application, due to their intrinsic unique performance in the thermal conduction. Theoretical work suggests that a covalently bond can combine one dimensional CNT with two dimensional graphene to extend the excellent thermal property to three dimensions. This can be more effective in heat dissipation field. In this talk, we experimentally demonstrate the heat dissipation capability of a free standing three dimensional (3D) carbon nanotube (CNT) and graphene film (GF) hybrid material, which was synthesized through chemical vapor deposition (CVD) process. The temperature of the hot spot on a thermal test chip can be decreased around 10 oC with the help of this hybrid material. The thermal junction resistance of this covalent bond was 9e-10 m2K/W, which is three orders of magnitude lower than vad der waals contact. These findings are significant for understanding the thermal property for combined 1D and 2D carbon material for future thermal management application.
CGIA supports members to focus on application and industry chain, to keep pace with market development, to guarantee industry interests by involving in policy making and establishing standards, and to build long-term cooperation with up-down stream enterprises all over the world.
E-mail: meeting@c-gia.org
Abstract: Minyang Lu
Sponsor: Wenyang Yang
Media: Liping Wang
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