Dr.Yong Zhang graduated with a PhD degree in Shanghai University with a focus on graphene heat spreaders for electronics thermal management applications in electronic packaging. His research interests cover nano-carbon materials for 3D electronics packaging. This includes the fabrication and characterization of graphene and related other dimensional carbon-based materials for thermal management applications.
The continuous size shrinking and increased integration density result in an increased heat flux on an electronic chip.Overheating of components may cause irreparable damage to the chip. Thus,effective heat dissipation from the component to the ambient is essential for keeping the temperature below the point where overheating occurs. One possible solution is using 2D heat dissipation materials as heat spreader for cooling applications. These materials include mono layer, multi layer graphene and graphene-based films (GBF). Controlling growth of mono layer and multi layer graphene via chemical vapor deposition(CVD) is crucial for the applications. In this presentation,the controlling growth mono layer and bilayer graphene on Cu alloys via CVD ispresented. In addition, liquid phase exfoliated graphene-based films as heat dissipation material is also introduced.
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E-mail: meeting@c-gia.org
Abstract: Minyang Lu
Sponsor: Wenyang Yang
Media: Liping Wang
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