凯发

As electronic deviceschange faster and smaller, more heat generates in chip. Furthermore, non-uniform heat dissipation also leads to the overheating of specific areas in chip, largely affecting computing performance and reliability of electronic devices.Generally, if the temperature of the hot spot is reduced by 20oC, the transistor’s lifetime would be extended by one order of magnitude. Therefore, thermal management of hot spots with localized high heat flux is quite critical in packaging industry. In this research, some novel two-dimensional (2D) materials were used for heat spreading, such as horizontally and vertically oriented graphenes, and hexagonal boron nitride (hBN). Besides, to replace the traditional insulation material with poor thermal conductivity such as silicon dioxide (SiO2), stack and compositestructures of graphene and hBN were developed. Compared with stack structure, the composite films showed better heat dissipation effect as well as a good insulation.At the heat flux density of 1000 W/cm2, the temperature of the hotspot could be decreased by 8-10°C.In conclusion, these 2D materialshave been proved to be useful for reducing the temperature of hot spots, and might be good heat spreader materials for packaging applications in the future.